SEAMP Serie Platine-zu-Platine & Mezzanine-Steckverbinder

Ergebnisse: 112
Auswählen Bild Teile-Nr. Herst. Beschreibung Datenblatt Verfügbarkeit Preis (CHF) Ergebnisse in der Tabelle nach dem Einheitspreis bei Ihrer Menge filtern. Menge RoHS ECAD Model Produkt Anzahl der Positionen Abstand Anzahl der Zeilen Montage Montagewinkel Nennstrom Nennspannung Minimale Betriebstemperatur Maximale Betriebstemperatur Kontaktüberzug Kontaktmaterial Gehäusematerial Serie Verpackung
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 1 Woche
Min.: 225
Mult.: 225
: 225

Headers 300 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Pin Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 1 Woche
Min.: 225
Mult.: 225
: 225

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 30
Mult.: 30

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 8 Wochen
Min.: 225
Mult.: 225
: 225

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 1 Woche
Min.: 225
Mult.: 225
: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 39
Mult.: 39

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 1 Woche
Min.: 350
Mult.: 350
: 350

Headers 160 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 1 Woche
Min.: 225
Mult.: 225
: 225

Headers 240 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 9 Wochen
Min.: 30
Mult.: 30

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 11 Wochen
Min.: 225
Mult.: 225
: 225

Headers 320 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 225
Mult.: 225
: 225

Headers 400 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 42
Mult.: 42

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 200 Position 1.27 mm (0.05 in) 4 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 1 Woche
Min.: 225
Mult.: 225
: 225

Headers 300 Position 1.27 mm (0.05 in) 6 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Reel
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 30
Mult.: 30

Headers 400 Position 1.27 mm (0.05 in) 8 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 27
Mult.: 27

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tray
Samtec Platine-zu-Platine & Mezzanine-Steckverbinder .050 SEARAY High-Speed High-Density Open-Pin-Field Array Terminal Nicht-auf-Lager-Vorlaufzeit 2 Wochen
Min.: 1
Mult.: 1

Headers 500 Position 1.27 mm (0.05 in) 10 Row Solder Straight 2.5 A 215 V - 55 C + 125 C Gold Copper Alloy Nylon SEAMP Tube